1.5 Watt mk Thermal compound grease heat paste for thermal conductive between electronic components and heat sink SFY-635

1.5 Watt/mk Thermal compound grease heat paste for thermal conductive between electronic components and heat sink SFY-635
Since 1983, FONG YONG CHEMICAL CO., LTD. has been a main Taiwan manufacturer on supplying epoxy, PU resin, silicone, thermal paste, thermal adhesive, UV cure adhesive globally.
SFY-635 heat sink is a grey paste silicone product heavily filled with heat-conductive metal oxides. The incorporation of high efficient heat-conductive metal oxides promotes high thermal conductivity, low bleeding, and high-temperature stability. Up to approximately 175oC, the product is very stable to changes of temperature. It helps to maintain a positive heat sink seal that improves heat transfer from the electrical / electronic devices to the heat sink or chassis, thereby increasing overall efficiency of the devices.Uses
SFY-635 heat sink is used to the base and mounting studs of transistors, diodes, and silicon-controlled rectifiers. It can also serve as a thermal coupler for many heat sink devices where efficient cooling is required. This product has also been applied as a high voltage corona-suppressant, non-flammable coating in connections for fly-back transformers in TV sets and similar applications.Characteristics
Appearance
Grey Paste
Specific Gravity (25 oC, ASTM D 1475)
2.76
Bleed after 24 hours at 200 oC (%)
0.05
Evaporation after 24 hours at 200 oC (%)
1.5
Drop Point (oC, ASTM D 2265)
300
Thermal Conductivity (W/mK, ASTM D 2214)
1.5
Dielectric Strength (volts/ mil, ASTM D 149)
200
Arc Resistance (sec, ASTM D 495)
160
Dielectric Constant
(ASTM D 150)
100 Hz: 5 Volume Resistivity (ohm-cm, ASTM D 1169)
1.3x1014
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