Item
ProducingCapability
Layers
1-20(IncludingRigidandFlexibleCircuit)
PanelSize
Max:250*550(mm)
DrillingDiameter
Max.Diameter:6.5mm(256mil)
Min.Diameter:0.20mm(8mil)
baseMaterialCopperThickness
Max:3oz
Min:1/3oz
InsulatingLayerThickness
Max:0.05mm(PI)(2mil).
Min:0.0125mm(PI)(0.5mil)
ElectroplatingSn/PbThickness
3μm---20μm
ElectroplatingAuThickness
Au:≥0.05μm
Ni:1μm-5μm
ChemicalImmersionNi/AuThickness
0.05μm----0.1μm
ElectroplatingSnThickness
3μm---20μm
ErchingLineWidth&Space
S/S:2.5mil(0.06mm)
D/S:2.5mil(0.06mm)
EtchingTolerance
Width:±20%
SpecialWidth:±10%
OutlineTolerance(fromsidetoside)
±0.05mm(±2mil)
PartsFixedPositionTolerance
±0.2mm(8mil)
ProductCatalogSurfaceFinish
1.Electrical/ImmersionNi&AuPlatingBoard
2.Electrical/ImmersionTinPlatingBoard
3.OSPBoard