Led Wafer Alunimun Nitride Substrate Aln Substrate

Aluminum NitrideSubstrate
AlNSubstrate
Ascendus uses tape casting to produce high thermal conductivity aluminum nitride substrates.
In May 2018, Yinchuan Ascendus officially put into production, to achieve greater production capacity, to provide customers with high quality and stable aluminum nitride substrate.
Product advantagesHigh thermal conductivity 4 product types: As-fired type, grinding type, scribing type, polishing type, to meet various applications of customers Meet a variety of metallization applications: DPC, DBC, TPC, AMB, thick film printingSource quality control: using Ascendus independent research and development of aluminum nitride powder as raw material Thinner thickness products: 0.15mm, 0.25mm
Properties ItemUnitASD-ⅡASD-ⅢAppearanceColor-Gray / BeigeGray / Light GrayMicrostructureDense and fine grainDense and fine grainSurfaceμm0.25~0.50.3~0.5Warpage‰<1.5<1.5PhysicalVolume Densityg/cm33.343.363-Point Bending Strength Average[3-point Method]>380>370ThermalThermal Conductivity [@20℃]W/m·k170-185165-180ElectricalVolume ResistanceΩ·cm1.5x10131.3x1013Dielectric Constant-10.610.1Dielectric Loss-4.6x10-45.8x10-4Dielectric Strength(KV/mm)44.5342.38
Dimensions Squair Standard Substrate:Size Range(inch)2x24x44.5x4.5120x120mm5x55.5x7.56x6165x165mmThickness range(mm)
0.381√√√√√---0.5√√√√√-√-0.635√√√√√√√√1.0√√√√√√√√1.5√√√√√√√√2.0~4.0√√√√√√√√
Round Standard Substrate:Size Range(mm)26354045525060Thickness range(mm)1.00√√√√√√√1.50√√√√√√√2.00√√√√√√√ AlN Insulation sheet:Size Range(mm)20*2020*2521*1621*2722*2830*30Thickness range(mm)0.635√√√√√√1.00√√√√√√Can be punched√√√√√√