Biwin 2.5 inch SATA III SSD 256gb solid state drive with shakeproofProduct Description C6305Interface:SATA IIICapacity:32GB/64GB/128GB/256GBDimension (mm):100.20x69.80x7.00Weight:≤80gFlash:MLCMTBF:2 million hoursOperating Voltage:5V ±5%Power Consumption (Max):0.37W (Idle) 3.21W (Active)Operating Temperature:0 to 70 °CStorage Temperature: -40 to 85 °CHumidity:5 to 95%[ATTO]Sequential Read (Max):536 MB/s[ATTO]Sequential Write (Max):433 MB/sProduct ShowCompany Introduction
Corporate Overview:
Founded as an electronic product manufacturer in Shenzhen, China 1995, BIWIN specializes in producing flash storage products, including solid state drives, Compact Flash cards and USB flash drives. With 18 years' industry expertise and a strong team with over 150 skilled engineers, BIWIN develops its leading edge flash storage products completely in-house, including Solution Designing, Wafer packaging, IC Testing, SMT and Assembling, Product Testing. Manufacturing is conducted according to strict quality standards to ensure consistently high quality products.
Ceritificates:
All of our SSD products are ROHS directive-compliant, and carry CE ,FCCapprovals, And we offer all of the item with 3 years warranty.We have passed ISO 9001 , audit by SGS.
BIWIN Vision Statement:
BIWIN strives to become a leader in consumer electronic industry in the world.
BIWIN's Win-Win Philosophy:
BIWIN determines to be customer's best partner by understanding customers’needs and meeting their requirements. While customers enhance their core competitive ability, BIWIN perfects its services and becomes stronger. This is our Win-Win philosophy.
Full range of Product Line:
Including 2.5”SATA, 2.5”PATA, SATA DOM, PATA DOM, mSATA, CFast Card, CF Card, eMMC, eMCP, etc. Applicable to harsh operating temperature environments of industrial grade.
State-of-the-art Manufacturing:
-Quality Guaranteed Products
-Strict Quality Control Standards
-Short Lead Time
-Low Product Defect Rate
-Large production Capacity
Reliability Testing:
-High and Low Temperature Storage
-High and Low Temperature Operation
-High and Low Temperature Cycling
-ESD Testing
-Vibration and Shock Testing
-Room Temperature Aging Testing
-Power Failure Testing
Wafer Packaging Service:
-First 12" Wafer Packaging Factory in South China
-Include IC Design, Packaging, Testing, Assembling
-Wafer Packaging Products:TSOP 48, QFN, QFP, BGA, LGA, eMMC, UDP.