Business Type:
Manufacturer/Factory
R&D Capacity:
ODM, OEM, Other
OEM/ODM Service
Sample Available

1
    YRS
General Supplier

SE8116 UNDERFILL ADHESIVE GULE for Microdrop chip

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Min. Order / Reference FOB Price
1 Piece US $100.00/ Piece
Local Area: Yantai, Shandong, China
R&D Capacity: OEM, ODM, Other
Payment Terms: LC, T/T, PayPal
Brand: Seayu
CAS No.: 15625-89-5
Other Names: UNDERFILL GULE
MF: 15625

Product Description
Underfill SE8116 is a kind of heat cured adhesive. Low halogen .It can be cured at 120℃ ,designed foruse as a reworkable underfill resin for CSP or BGA.It is designed to give excellent protection from failure due to mechanical stress.
Packaging & Shipping
30ml/pc
Storage
Store at 2-8°C,keep away from light and moisture.
Shelf life:6 months.


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