Product Description Underfill SE8116 is a kind of heat cured adhesive. Low halogen .It can be cured at 120℃ ,designed foruse as a reworkable underfill resin for CSP or BGA.It is designed to give excellent protection from failure due to mechanical stress. Packaging & Shipping 30ml/pc Storage Store at 2-8°C,keep away from light and moisture. Shelf life:6 months.