Factory Hot Melt Film Adhesive Conductive Tape For Chip Bonding Of Smart Card

Product Description
Factory Hot Melt Film Adhesive Conductive Tape For Chip Bonding Of Smart Card



Description:
This hot melt adhesive film DS-5B is applied to the encapsulation of the contact smart card. It has excellent adhesion to PVC, ABS, PC, FR-4 materials. And aim at the damage to chip moudule due to high heat in the card-based laser bar code manufacture process , it can insulate the heat and avoide the thermal damage of module.This product belongs to modified macromolecular structure type black hot melt adhesive tape. Superior cohesion ensures that there is no structural breakage in the thrust and bending tests after bonding. At the same time, it maintains a balanced bond strength with the chip and the card base.It meets the requirements of ISO7816 for chip encapsulation fastness.



Black color, heat insulated, suitable for laser coding on the back of card.


Composition:
Polyamide synthesis modificationPhysical Characteristics:

Color
Black
Release liner
Glassine release paper
Density
1.2±0.02g/cm³
Conventional Thickness
55μm
Melting point
100-120℃
Conventional Width
29mm
Melt Flow Index
16±10g/10min ; Condition:ASTMD1238-04
Conventional Length
200m
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Finished Products Specification
55um*29MM*200M
Recommended Bonding Conditions:

First Lamination:
Second Implanting:
Machine Setting: 140℃-160℃
Machine Setting:170℃-190℃
Dwell Time: 0.6S-1.2S
Dwell Time: 0.6S-1.2S
Pressure:0.25-0.4mpa
Pressure: 0.25-0.4mpa
1, Bonding temperature and pressure as well as the time involved in the strength of the film to material. Bonding temperature must be close to the machine set the temperature, the pressure must be uniform, mold and pressure roller must be flat.
2, In different machinery and materials, the bonding conditions used will be different. The conditions marked here are only basic. The optimum bonding conditions should be made by creating suitable construction conditions for the particular application damage, direct or consequential, arising out of the use, misuse or inability to use the product.
Detailed Images
Applications:DS-5B is suitable for thermal encapsulation of IC cards, SIM cards, financial social security cards, and dual interface bank cards.

Packing & Delivery
Packaging Details: 1roll / bag, 20 rolls /CTN, or it's up on the customer's optionDelivery Time: Shipped in 3-5 days after payment by air express.

Certifications
Our Company
Our company was founded in 2007, With ten years of hot melt adhesive development, professional polymer technology team, research and development, production, sales as a whole.
The company has passed ISO9001:2008 enterprise management certification system.
The ISO9001 system control standards are strictly enforced from the production of raw materials to the production of film.
At present, we are equipped with two lines (underwater granule) of the imported modified hot melt adhesive, 2000 tons per year.

Related Products
FAQ
1 .How about hot melt adhesive film?
A: It is just a film, and the basic material is release paper. But the film is solid in room temperature, when reach its melt point, it is able to bond other materials, Different materials of hot melt adhesive film have different performances and different usages, we need understand your demands ,then recommend you right products to you.2.Do you accept OEM or ODM?
Yes ,we accept OEM and ODM, we are professional heat transfer material manufacturer ,having more than 10years experience. able to assist you R&D new products. So if you need bonding some special materials, please don't hesitate to let us know.3.How do you transport the products?
If you are not urgent, we usually transport by ship because it is the cheapest way. But for the West Asia area,
we deliver by train because there is no sea to ship. And for samples and urgent cargo, we transport it by air as it is the fastest way .Of course if you have other better idea about transport, we will accept it.4. May I have your samples?
If you need some sample for reference, please let us know your fully address/ship
mode with courier ,and we will arrange sample for your reference.5. How long is the lead time?
Sample lead time:3-7 days
Bulk lead time:7-10 days(depends on order quantity)
6. How do I pay for my order?
We accept L/C ,T/T ,Western Union , Paypal , Escrow

Contact Us
Jessica
Mobile phone ( Whatsapp & Skype & Wechat) : +86 181 2626 6195
Email address: tunsing05@dongshengqy.com