low melting point indium tin metal wire In52Sn48 foil

low melting point indium tin metal wire In52Sn48 foil
Product Introduction
Indium can be alloy with Sn, Pb, Ag and other elements to form a series of low melting eutectic solder.
Indium based solder has higher corrosion resistance to alkali medium, good wetting ability for both metal and nonmetal. welding spot made out of them is low in electrical resistance and high in plasticity,
it can be used in corresponding package with different thermal expansion coefficient
Product name:low melting point indium lead solder | ternary eutectic alloy
Type:In70Pb30|In60Pb40|In75Pb25|Pb60In40|Pb75In25|In50Pb50
In70Pb30 eutectic alloy solder, | In75Pb25 eutectic low melting solder material
Appearance:disc, ring, rectangle slice, square card, framework, gasket or as per your advice
Feature: low melting point (156 ℃),
Application:Electric vacuum devices, glass, ceramics and the sealing of low temperature superconductor devices, ceramic parts jointing material used in and heat conduction materials receiving PCB .
Specification
Product name
Melting point/℃
solid/liquid
Density
g/cm3
electrical resistance
μΩ.m
heat conductivity
W/m.K
thermal expansion
10-6/℃
Tensile Strength
Mpa
In70Pb30
165/175
8.19
0.195
39
28
23.78
In60Pb40
174/185
8.52
0.246
29
27
28.61
In75Pb25
183/286
9.96
0.194
-
-
23.62
Pb60In40
197/231
9.30
0.331
19
26
34.48
Pb75In25
240/260
9.97
0.375
18
26
37.58
In50Pb50
184/210
8.86
0.287
22
27
32.20