Various size corning glass wafer with high quality

- Introduction:

lGlass wafer:
The company introduces advanced laser equipment, ultrasonic instruments, engraving and grinding machines and other advanced equipment, and has experienced technicians who can provide customers with high-precision glass wafers with thickness≥0.1mm and external dimensions ≥Φ2" Glass wafer), used in CMOS, CCD sensors, integrated circuits or micro-mechanical component packaging (MEMS), communications and data processing, optics, electronics, home appliances, military, scientific research and other high-tech products.
lProductfeatures:
a)Application-specificuseofglassmaterial
b)Vastexpertiseintheareaofpolishinganduniquesurfacequalities
c)Cleanroomcompatiblepackagingofready-to-usesubstrates
d)Structuredwaferswithexcellenttolerances
e)Customer-specificproductsthatmeetallrequirementsandindustrystandards(e.g.SEMI)
f)IntegratedproductionprocessesthatmeetISO9001:2000requirementsandstandards
lTypical application:
Micro-optics
MEMS (pressure sensor, accelerometer...)
Wafer level packaging (image sensor package...)
Bioengineering (microfluidics, DNA analysis...)
PLC wafer cover
And many other customer-specific applications.
lTechnologyparameters:
a)Material:BOROFLOAT®33,PYREX7740,Quartzglass,
b) Thickness:0.3mm,0.5mm,0.6mm,0.7mm,1.0mm,1.5mm(Tolerance±0.02mm)
c) Roundize:Φ2",Φ3",Φ4",Φ5",Φ6",Φ8",Φ12"ect..
d)MIL:60/40
e)Roughness(Ra)Less1.5nm
f)TTVLess0.01mm
g)ChamferC0.05~0.2mm
h)EdgecollapseLess0.2mm
Glass wafer plus technical parameter:
a) Material: BOROFLOAT®33, PYREX7740, quartz glass, Corning E-XG, B270, D262T, AF32
b) Standard thickness: 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.7mm, 1.0mm, 1.5mm (thickness tolerance ± 0.02mm)
c) Standard size: Φ2", Φ3", Φ4", Φ5", Φ6", Φ8", Φ12" (other sizes can be customized)
d) Appearance: 60/40
e) Surface roughness (Ra) <1.5nm
f) Parallelism <0.01mm
g) Each edge is blunt C0.05~0.2mm
h) Crack <0.2mm, not crackable
i) The surface is clean and must not be imprinted or stained. It is packaged under a clean workbench and packaged in a special box.
Basic performance of glass wafers:
Technical parameters: density (25 ° C) 2.23g / cm2
Expansion coefficient (ISO 7991) 3.25'10-6k-1
Light transmittance 91%
Softening point 820 ° C
Short-term use <10h 550 °C
Long-term use≥10h 450°C
Refractive index (587.6nm) 1.47140
Knoop hardness 480

Product picture of the application area as follows: