Business Type:
Manufacturer/Factory,Trading Company,Agent
Business Range:
polyimide tape, 3M tape, Masking tape, mylar tape, micro suction tape
Establishment:
2012
R&D Capacity:
OEM, ODM, Others
Terms of Payment:
LC, T/T, D/P, Paypal, Western Union
Main Markets:
North America, Eastern Europe, Northern Europe
OEM/ODM Service
Sample Available

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Supplier Homepage Packaging, Advertising & Office Packaging & Printing Thermal release adhesive tape for LED lighting

Thermal release adhesive tape for LED lighting

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Min. Order / Reference FOB Price
20 SquareMete US $30.00/ SquareMete
Local Area: Xiamen, Fujian, China
R&D Capacity: OEM, ODM, Other
Payment Terms: LC, T/T, D/P, Paypal, Western Union
Brand: Kingzom
Place of Origin: Fujian, China
Brand Name: Kingzom
Model Number: KZ Thermal release tape-21007
Thermal release adhesive tape for LED lighting
Solutions
Thermal release tape process and temporary carrier technology has been developed for various electronic components manufacturing processes. This tape can support components during operational process and is easy to peel off when necessary by just heating.
Product Description
The "Kingzom" thermal release tape is a unique adhesive tape that adheres tightly at room temperature and can easily be picked up just by heating. It's made from polyester film coated with thermal-release adhesive on both sides or one side. The tape contributes significantly to automation/laborsaving of various electronic component manufacturing processes.
Features
Its adhesion effect is as good as any other normal adhesive tape at room temperature; can easily be peeled off when necessary by just heating.Suitable for temporary fixing in electronic component manufacturing processes.Can be removed easily without damaging the substrate to which applied.Able to select temperatures for releasing (90°C, 120°C or 150°C).Various shapes are available such as in rolls, sheets and labels etc.Free samples and custom sizes are available upon request.
Applications
For electronic component manufacturing processes and other various temporary fixing.For processing brittle wafer,especially recommended for semiconductor wafer backing grind processing.Note: Custom sizes are available upon request and supply free sample for test.
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