High Performance Peltier Thermoelectric Cooler Tec1-12706

High Performance Peltier Thermoelectric Cooler Tec1-12706
Features:
1. Fast cooling.
2.The cooler works without noise, vibration and wear. It has a long lifetime and high reliability.
3.It is small and light.
4.It can control temperature with high accuracy and work as soon as the power is on. No waste is produced to pollute the environment.
5.The heating is permitted under suitable condition.
Fields of application:
1.In high-tech fields.
Satellite, semiconductor laser,photoelectric device, infrared detector, etc.
2.Family electical equipment
Electronic moistureproof box, cooling and heating box, drink refrigerator, cooler, etc.
3.In electronic technology
4.In some industries
5.In medical instruments, agriculture and biology
Specifications: TEC1-12706The following picture12720AWG UL1569 105℃ Standard tinning wire,PVC insulation skin,Lead length350±5mm,End department bare 7±1mm,Lead welds in heat surface one end1.95~2.20Ω(Environmental temperature 23±1℃,1kHZ Ac)65~68℃12VDC 4.7A,15.4VDC 6.3A15.4VDC56W(15.4VDC)98N/cm2-55℃~80℃704 silicon rubbersHot surfaceFoam box,10 Box / carton,50 pieces / boxEnvironmental temperature-10℃~40℃,Relative humidity≤80%,Ventilate and no corrosivity gasPrinciple of thermoelectric peltier module
Semiconductor refrigeration sheet also called thermoelectric peltier module, is a heat pump, is a heat transfer tool. When a pair of n-type semiconductor materials and a p-type semiconductor materials are connected, when there is a current passing through the two ends, there will be a heat transfer between the two ends, and the heat will be transferred from one end to the other end, thus creating a temperature difference to form a hot and cold end. However, there is resistance in the semiconductor itself. When the current passes through the semiconductor, it will generate heat, which will affect the heat transfer. Moreover, the heat between the two substrates will also conduct reverse heat transfer through the air and the semiconductor material itself. When the hot and cold ends reach a certain temperature difference and the two heat transfer amounts are equal, an equilibrium point will be reached and the positive and negative heat transfer cancel each other out. The temperature at the hot and cold ends will not continue to change. In order to achieve lower temperature, heat dissipation and other ways can be adopted to reduce the temperature of the hot end to achieve.
The role of fans and heat sinks is mainly to dissipate heat at the hot end of the cooling sheet. Generally, the temperature difference between the hot and cold ends of the semiconductor cooling sheet can reach 40-65 degrees Celsius.
When a piece of n-type semiconductor material and a piece of p-type semiconductor material are connected to form an electric couple, after the direct current is connected in this circuit, heat transfer can be generated. The connection from the p-type element to the n-type element releases heat and becomes the hot end. The magnitude of heat absorption and heat release is determined by the magnitude of the current and the logarithm of the N and P components of the semiconductor material.ContactFAQ
1. Q: How long is theuseful life of this component
A: nomal useful life is 100,000 hours, according to personal usage
2. Q: what will shorten the lifespan of module?
A: 1.alternate use hot and cold frequently. 2.in vibration circumstance. 3.radiator temperature over 65 degrees. 4.over the vlotage. 5. the hot suface of module connection is not bad.
3. Q: How to prolong the lifespan?
A: To prolong the lifesapn, should seal aroud the component to completely isolated with outside air. you can use 704 silicone or epoxy resin
4. Q: how do you check with a multimeter tester or other means to find out if the module is normal or not?
A:check with a multimeter tester is not very correct,only can be reference. you can test with data bridage or balanced resistance meter to test the resistance of module.