Layer
Single Sided,2-30 Layer
2
Board Thickness
0.21mm~7.00mm
3
Board Material
FR-4,CEM-1,CEM-3,High TG,FR4 halogen Free,Rogers,Aluminum
4
Max.finished board size
580*900mm
5
Min.drilled hole size
3mil(0.075mm)
6
Min.Line width&spacing
3mil(0.075mm)
7
Surface finish/treatment
HASL/HASL lead free,HAL,Chemical tin,Chemical Gold,Immersion Silver/Gold,OSP, Gold plating.
8
Copper Thickness
0.5oz-7oz
9
Solder Mask Color
Green/Yellow/Black/White/Red/Blue
10
Copper Thickness In Hole
>25.0 um(>1mil)
11
Inner packing/Outer packing
Vaccum Plastic bag/Standard carton packing
12
Hole/Shape tolerance
PTH: ±0.076 NPTH: ±0.05/±0.13
13
Cerification
UL.ISO9001.ISO14001.SGS.ROHS
14
Special requirements
Buried and blind vias+Controlled impedance+BGA
15
Profilling
Punching.Routing.V-CUT.Beveling
16
Provides OEM Services to all sorts of printed circuit board assembly as we as electronic encased products.