Best circuit board induction cooker Assembly Circuit Board Induction Cooker in China

Product DescriptionContact: Mandy
Skype: b704b0cf022d2911China new design manufacture dc 12v induction cooker pcb board Minimum IC Pitch 0.2mm Maximum PCB size 1200x 500mm Minimum PCB thickness 0.25mm Minimum chip size: 0201 (0.2x0.1)/0603 (0.6 x 0.3mm) Maximum BGA size: 74x74mm BGA ball pitch: 1.00mm (minimum), 3.00mm (maximum) BGA ball diameter: 0.40mm (minimum), 1.00mm (maximum) QFP lead pitch: 0.38mm (minimum), 2.54mm (maximum) Volume: One piece to low volume production quantities
Low cost first article builds
Schedule deliveries Assembly type: Surface mount(SMT) assembly
DIP assembly
Mixed(surface mount and through hole) technology
Single or double sided placement
Cable assembly Components type: Passive components:
As small as 0402 package
As small as 0201 with design review
Ball Grid Arrays(BGA):
As small as .5mm pitch Parts procurements: Turnkey(we supply the parts)
Consigned(you supply the parts) Solder type: Leaded
Lead-free/ROHS compliant PCB ItemManufacture Capacity Layer Counts 1--30L base Material FR4,High-TG FR4,CEM3,aluminum,High Frequency(Rogers,Taconic,Aron,PTFE,F4B) Material Thickness(mm) 0.40, 0.60, 0.80, 1.00, 1.20, 1.50, 1.60, 2.0, 2.4, 3.2 Max board size(mm) 1200x400mm Board Outline Tolerance ±0.15mm Board Thickness 0.4mm--3.2mm Thickness Tolerance ±8% Minimum line/space 0.1mm Min Annular Ring 0.1mm SMD Pitch 0.3mmHoles Min Hole Size(mechanical) 0.2mm Min Hole Size(laser hole) 0.1mm Hole Size Tol (+/-) PTH:±0.075mm;NPTH: ±0.05mm Hole Position Tol ±0.075mmPlating HASL/LF HAL 2.5um Immersion Gold Nickel 3-7um Au:1-5u'' Surface Finish HAL,ENIG,Plated Gold,Immersion Gold,OSP Copper Copper Weight 0.5--6oz
Contact: Mandy
Skype: b704b0cf022d2911