Copper Foil Tape Kills virus For Supermarket Items

Product Description
1.Backing: 1mil copper foil
2.Adhesive:conductive adhesive
3.Copper foil tape is made of copper foil backing, single sided coated with conductive acrylic adhesive.
1.Standard Length: 50m
2.Thickness: 0.06mm
3.Width: customized width is available
4.Minimum width: 3mm1.Copper foil tape with non conductive adhesive is suitable for applications which requires excellent electrical conductivity.
2.It can conduct the electricity from the conductive adhesive to the foil backing.
3.EMI shielding
4.GroundingCopper Foil
Non-Conductive Adhesive
White Release Paper Item
NKSCA-006
Color
Copper
Carrier
Copper Foil
Adhesive
Conductive Acrylic Adhesive
Carrier Thickness(mm)
0.025
Total Thickness (mm)
0.06 ± 0.005
Appearance
Excellent, no oxidation
Initial Tack(Steel Ball) (#)
11
Resistance(ohm/in2)
<0.05
Holding Power(1kg/inch)
≥1140
180°Peeling Strength
>8 N/25.4mm
Application Temperature
-20~120℃
Storage Condition
20℃,65% RH
Specification
Length(m)
50/100
Width(mm)
2~1200 (custom slit)
Related Products
ApplicationGuideline
1.) Substrate surfaces should be clean and dry prior to tape application. Isopropyl alcohol (isopropanol) applied with a lint free wipe or swab should be adequate for removing surface contamination such as dust or finger prints. Do not use “denatured alcohol” or glass cleaners which often contain oily components. Allow the surface to dry for several minutes before applying the tape. More aggressive solvents (such as acetone, methyl ethyl ketene (MEK) or toluene) may be required to remove heavier contamination (grease, machine oils, solder flux, etc.) but should be followed by a final isopropanol wipe as described above.Note: Be sure to read and follow the manufacturers’ precautions and directions when using primers and solvents.2.) Apply the tape to one substrate at a modest angle with the use of a squeegee, rubber roller or finger pressure to help reduce the potential for air entrapment under the tape during its application. The liner can be removed after positioning the tape onto the first substrate.3.) Assemble the part by applying compression to the substrates to ensure a good wetting of the substrate surfaces with the tape. Proper application of pressure (amount of pressure, time applied, temperature applied) will depend upon design of the parts. Rigid substrates are more difficult to bond without air entrapment as most rigid parts are not flat. Use of a thicker tape may result in increased wetting of rigid substrates. Flexible substrates can be bonded to rigid or flexible parts with much less concern about air entrapment because one of the flexible substrates can conform to the other substrates.
Payment & Shipment
Our Services
OUR SERVICES B. Professional recommendations on tape choice for customers.
C. Free samples available.
D. Competitive prices.
E. In time delivery.
F.Quality assurance. 1. Here you will find the most competitive factory price which is almost equal to the actual cost.
2. We will make a strict time schedule for your order to 100% ensures the timely delivery.
3. We can make the tape into the size or shapes as requested.
4. You will be kept updated of the production state during the whole production process.
5. Over 12 years on the tape manufacturing.
6. prompt reply within 12 hours.
7. Custom logo printing is accepted.
Company Information
COMPANY INFORMATION
FAQ
Thanks for your time in viewing our tapes. If you find our tapes interested, please fill the below blank space with your detailed requirements. NAIKOS’s sales team would be happy to serve you within 12 hours.
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