Double Adhesive Thermally Conductive Adhesive Tape for LED PCB Attachment

Product Description
NKS double adhesive thermally conductive adhesive tape is made of an advanced thermal conductive pressure sensitive adhesive. NKS series provides a better way for applications requiring good adhesion strength and superior thermal conductive efficiency.NKS series is suitable to apply to electronic mechanical components assembly such as the heatsink module and LED light bar module to provide a better heat-transfer path between heat generating components and heat sink or other cooling devices.
* Good adhesion and thermal conductivity
* Flexibility, conformability
* Wide working temperature range
* Various thicknesses for choice
* Stable and Economy* Electronic components: IC, CPU, MOS
* LED, M/B, PS, heat sink, LCD-TV, PC
* DDRLL Module, DVD* Fans, heat spreaders or heat pipesThermally Conductive PSA
Release Film Thickness180°Peel Strength
(PSTC-101
)(N/25mm)
Insulation Strength
(ASTM D149)
(KV)
Thermal Impedance@40PSI
(AMD2240)
(C*in2/W)
Thermal Conductivity
(ASTM D22470)
(W/m-k)
Temperature Range
NKS-05
0.05±10%
>13.72
2.0
0.453
1.20
-20℃~+120℃
NKS-10
0.10±10%
>13.72
2.5
0.626
NKS-15
0.15±10%
>13.72
3.5
0.715
NKS-20
0.20±10%
>13.72
5.0
1.125
NKS-25
0.25±10%
>13.72
6.0
1.196
NKS-30
0.30±10%
>13.72
6.0
1.445
NKS-50
0.50±10%
>13.72
6.0
2.098
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ApplicationGuideline
1.) Substrate surfaces should be clean and dry prior to tape application. Isopropyl alcohol (isopropanol) applied with a lint free wipe or swab should be adequate for removing surface contamination such as dust or finger prints. Do not use “denatured alcohol” or glass cleaners which often contain oily components. Allow the surface to dry for several minutes before applying the tape. More aggressive solvents (such as acetone, methyl ethyl ketene (MEK) or toluene) may be required to remove heavier contamination (grease, machine oils, solder flux, etc.) but should be followed by a final isopropanol wipe as described above.Note: Be sure to read and follow the manufacturers’ precautions and directions when using primers and solvents.2.) Apply the tape to one substrate at a modest angle with the use of a squeegee, rubber roller or finger pressure to help reduce the potential for air entrapment under the tape during its application. The liner can be removed after positioning the tape onto the first substrate.3.) Assemble the part by applying compression to the substrates to ensure a good wetting of the substrate surfaces with the tape. Proper application of pressure (amount of pressure, time applied, temperature applied) will depend upon design of the parts. Rigid substrates are more difficult to bond without air entrapment as most rigid parts are not flat. Use of a thicker tape may result in increased wetting of rigid substrates. Flexible substrates can be bonded to rigid or flexible parts with much less concern about air entrapment because one of the flexible substrates can conform to the other substrates.
Payment & Shipment
Our Services
OUR SERVICES B. Professional recommendations on tape choice for customers.
C. Free samples available.
D. Competitive prices.
E. In time delivery.
F.Quality assurance. 1. Here you will find the most competitive factory price which is almost equal to the actual cost.
2. We will make a strict time schedule for your order to 100% ensures the timely delivery.
3. We can make the tape into the size or shapes as requested.
4. You will be kept updated of the production state during the whole production process.
5. Over 12 years on the tape manufacturing.
6. prompt reply within 12 hours.
7. Custom logo printing is accepted.
Company Information
COMPANY INFORMATION
FAQ
Thanks for your time in viewing our tapes. If you find our tapes interested, please fill the below blank space with your detailed requirements. NAIKOS’s sales team would be happy to serve you within 12 hours.
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