Ultrafine Copper Powder 2um

Ultrafine Copper Powder
Ultrafine CuAg Alloy Powder
Ultrafine CuNi Alloy PowderSpecification
particle sizespecific surface areaLaser Particle SizePSA(m)
Tap densityD10
D50
D90
Cu-01
0.30
1.69-2.69
0.50
1.00
1.80
2.60
Cu-02
0.50
1.10-1.70
1.20
1.50
3.50
3.00
Cu-03
1.00
0.50-1.00
1.50
2.50
5.50
3.50Application:Be extensively applied to conductive adhesive, conductive coating, polymer paste, micro electronic technique field with demand for conduction and static conduction, electromagnetic shielding, and non-conductive material surface metallization treatmentSize Distribution (m)Specification
Mean particle sizeSpecific Surface areaTap DesityNi content(%)
CuNi-01
0.50
1.04-1.69
3.00
10,20,30
CuNi-02
1.00
0.56-0.90
3.50
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