Hotmelt Adhesive for Book Binding RY6852
APPLICATION Hot-melted adhesive, designed as back glue for bookbinding application and so on.
PROPERTIES Good melting properties
No stringing
Good thermal stability
Good wetting properties
Fast setting and good flexibility
TECHNICAL Viscosity3500-5000CPS@170°C
DATASoft Point71-81º C
Appearance White granule
Solid Content 100%
CONDITION 1.It an be used on high-speed and medium-speed bookbinding flow-line and non
flow-line machine.
2.Recommended operation temperature: 150-180°C (Don’t exceed 180°C).
3.The supports and edges must be at ambient temperature(which should not be less
than 15°C).
STORAGE24 months in its original package at an average temperature of 25°C or below. Store in
a clean, dry area. Keep containers closed. Storage temperature should not exceed 40°C.
PACKAGE25kg/bag