Business Type:
Manufacturer/Factory
Business Range:
ACF Attach machines, COG Bonding machine, FOG Bonding machine, LCM Bonding machine, ACF Bonding machine
Establishment:
2012
R&D Capacity:
OEM, ODM, Others
Terms of Payment:
LC, T/T, D/P, Paypal, Western Union
Main Markets:
Domestic Market, South Asia, Southeast Asia
OEM/ODM Service
Sample Available

Shenzhen Olian Automatic Equipment Co., Ltd (Olian) is a high-tech enterprise established in 2008, specialized in R&D, manufacturing and sales of LCD module automatic equipment.Olian insist on the pro...

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Supplier Homepage Machinery, Industrial Parts & Tools Machinery Electronic Products Machinery 65INCH 85INCH 100INCH TV LAPTOP DOUBLE PRESS HEAD ACF/COF/TAB/OLB/PCB BONDING MACHINE

65INCH 85INCH 100INCH TV LAPTOP DOUBLE PRESS HEAD ACF/COF/TAB/OLB/PCB BONDING MACHINE

Get Latest Price
Min. Order / Reference FOB Price
1 Sets US $7500.00/ Sets
Local Area: Shenzhen, Guangdong, China
R&D Capacity: OEM, ODM, Other
Payment Terms: LC, T/T, D/P, Paypal, Western Union
Brand: Olian
Brand Name: Olian
Voltage: AC220V/50Hz
Power(W): 4400W
65INCH 85INCH 100INCH TV LAPTOP DOUBLE PRESS HEAD ACF/COF/TAB/OLB/PCB BonDING MACHINEProduct Description
•Pulse Heat ACF TAB FPC COF Bonding Machine for LCD LED TV Screen Repair
•Design for 12” – 85” LCD/LED TV PANEL repair.
•Bonding ACF and FPC/COF/FOG/TAB to LCD (TFT, IPS).
•Control by PLC, pulse heating method.
•Touch screen operation, multiple bonding parameters can be set.
•FPC/COF/FOG/TAB hot bar process.
•Platform can move at X, Y and Z direction flexibly.
•CCD system helps to place work piece.
ACF BonDING MACHINE SPECIFICATIONS
Equipment Model Number
OL-1285DH(DoubleHead)
Device Description
Repair screen machine / Bonding machine
Device Uses
FPC, COF,TAB, LCD Panel and PCB combination bonding
Applicable LCD panel specifications
12"-85"
Applicable LCD panel thickness
0.3MM-1.1MM[Single glass]
Bonding IC number
Multiple / Panel
Bind direction
X or Y Uni-direction
Supply Pressure
0.5~0.7Mpa (Dry air source)
Power Supply
AC 220V±10%,50HZ,4400W
Cylinder Device
SMC original thin cylinder
Pressure System
Pressure system parallel bars structure can eliminates Indenter own weight, the pressure minimum accuracy to 0.1 KG , pressure part both are use SMC precision components
Heating Type
Pulse (rapid heating / cooling and auxiliary cooling function)
PID Temperature Control System
Branded:Adjustable heating curve Precision PID self-tuning type
The peak temperature : within +/- 2 degrees Celsius Room temperature time to 180 degrees the response time within 2-3 seconds
Hot pressing head
Materials: Titanium
origin: United States 45*1.4*10
Plane precision (hot press side) :0.001mm
Plane thickness 0.5 (Reserved 3 times grinding)
Thermocouple Type
K type OMEGA wire Model:OL-1285DHProduct Name:FOF single station Pulse Heating Bonding machineSuitable For:Suitable for FPC/COF Contraposition bonded to LCD which attached ACF,Used for COF repairSize Range:12-85inchBonding Precision:X±0.01MM ,Y±0.01MMMachine Capacity:12S/Pcs,2500pcs/dayIndenter Qty:1PCSPower Supply:220V±10%,50HZ,1200WAir Supply:0.4~0.7MPa,dry airFPC size:Max:L80*W60MM Min:L10*W15MMPlatform Precision:±0.01MMPressure Head Size:80*1MM (customizable)Temp Range:RT~400℃Time Range:1~99.9secProduct Size:W1200*1200*H1380MMN.W:about 550kgPacking Size:G.W:about 550kg 6CBM1, The common explanation:
ACF is anisotropic conductive film, a kind of material in thebonding process to be used in capacitive screen, resistive screen,touch screen, LCD screen, tablet PC, mobile phone screens, etc.Meansa resin film containing a heat-conductive particles of athermoplastic or cured. Mainly for LCD panel signal transmission linkwith the driver IC, the need to bonding different interface to choosesuitable conductive particles and density, generally used for finepitch of the conductive particles having a diameter of about 3 ~ 5um.
2, Professional explanation:
The English abbreviation of ACF is Anisotropic Conductive Film, ACFis the electrical conduction in the Z-axis direction and the XYinsulation resistance characteristic plane has obvious differences.When the difference between Z-axis and the XY plane on-resistancevalue of the insulation resistance exceeds a predetermined ratio,also can be called well anisotropic conductivity.
1, The popular explanation:
COF package is to put the IC dependend on FPC: COF package for flip chip film.
2, Professional explanation:
COF is the abbreviation of Chip - on - flex, is to put the IC dependend on FPC,a new technology developedof liquid crystal display module, by it in terms of product size, weight, high integration, have very big breakthrough.Due to the flexible circuit board PCB thickness thin, lighter than the solid, so COF package module is small volume, light weight, and the design and production speed is quickly.

1, The popular explanation:
Pulsed hot pressing machine is by hot pressing head loading pulse voltage, hot head heating , will be connected to the object, when the temperature rises to solder melting point after (i.e., after the rise to the predetermined temperature), will be connected to the tin melting between the objects and put it together.Applied to mobile phone manufacturer, touch screen manufacturers, such as computer, printer manufacturers, production technology applied in the following products: USB wire welding, soft wire FFC flexible PCB FPC or rigid circuit board PCB welding, TCP and circuit board PCB or PCB FPC welding between soft,welding?flexible circuit board FPC between circuit board PCB , etc.
2, Professional explanation:
Pulse hot press is the English translation of Pulse hot press, by hot pressing head loading Pulse voltage, ?hot head heating , will be connected to this object to heat up, when the temperature rises to soldering tin melting point (i.e., to simulate the temperature after), will be connected to the tin melting between the objects and connect it together. The general Pulse hot-press temperature closed loop control.Packaging & ShippingOur ServicesCompany Information
Shenzhen Olian Automatic Equipment Co., Ltd (Olian) is a high-tech enterprise established in 2008, specialized in R&D, manufacturing and sales of LCD module automatic equipment.
Olian insist on the product concept of " High quality, High efficiency", have successfully developed standard and custom products:
Main products
1. LCD module machine:
Large, medium and small size COG machine, Semi-automatic COG machine, Automatic COG machine, ACF attach machine, COG press bonding machine, TAB, FOG hot press bonding machine, SMT machine, Tear film machine, detection device, PLASMA, LCD clearing machine;
Auxiliary equipment: IC disassembling machine, ACF split machine, Molybdenum wire machine, Heating platform, Manual or pneumatic test stand, etc;
2. Capacitive screen Touch screen device:
G + F laminating machine, G + G vacuum laminating machine, Touch screen ACF attach machine, Touch screen FOG, Hot press machine, PETOCA laminating machine, F + F, Automatic laminating machine, TP protective film laminating machine;
3.Large size LCD Equipment:13-55 inch ACF attach machine, COF press machine, PCB press machine, COF Pre-press machine, OLB Bonding machine;
4. Non-standard program design and development;
5. Accessories and maintenance of the LCD module and TP equipment: Quartz, Test stand, All kinds of indenter( SU440C indenter, Tungsten steel indenter, Titanium alloy indenter) production and maintenance, grinding or design.
Olian welcome customers to visit our company for technical exchange and business negotiation. Olian will do the best to provide you with high quality equipment and satisfactory service. Olian determined to become the leading brands of the industry.
Olian Welcome agents and reseller around the world,
Welcome OEM&ODM for you.FAQ

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