Product Description
Brand: HI BON (Japan ZTE)
Model: 11-583
Specification: 0.14mm*1200mm*50m
Operating temperature range: 120 ° C
Uses: Battery Bonding , Battery Door Attachment , Camera Module Assembly , Case Assembly , Electronic Component Bonding , Foam Bonding , Foam Gasket Bonding , Logo Bonding , Memory Card Bonding , Module Bonding to PET Card , Rubber Feet Bonding , Speaker Module Assembly , Touchpad Assembly , Touchpad Bracket Assembly , Wire and Cable Clip Attachment. Product CodeHI BON 11-583NameTissue tapeThickness(mm)0.14AdhesiveAcrylicBackingtissueColorTranslucentLinerpaperShort-term temperature160Long-term temperature120Adhesion to Steel(N/25MM)12Holding power
1kg/25mm/h10
Main product
Company Information
Established in 2009, Shenzhen Xiangyu New Material Co.,Ltd specializes in the business of tape.
WIth the back of high advanced transport system in Shenzhen, and high development tech from cooprated manufactures and factories, our mature produce skill, Xiangyu have already be a company covers an area of an area of ten thousand square feets and its employees up to 128 staff members.