Business Type:
Manufacturer/Factory,Trading Company,Buying Office
Business Range:
PCB, 1Layer PCB, 2layer PCB, Multilayer PCB, PCB Assembly
Establishment:
2014
R&D Capacity:
OEM, ODM, Others
Terms of Payment:
LC, T/T, D/P, Paypal, Western Union
Main Markets:
Domestic Market, Eastern Europe, Southern Europe
OEM/ODM Service
Sample Available

ShenZhen Hansion Technology co.,Ltd. was established in April,2005,After years'efforts, the company has expanded rapidly and kept Introducing new production equipments.We have also trained a pro...

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Supplier Homepage Packaging, Advertising & Office Service Equipment 2layer 4 layer 6layer PCB custom PCB manufacturer in shenzhen

2layer 4 layer 6layer PCB custom PCB manufacturer in shenzhen

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Min. Order / Reference FOB Price
1 Piece US $0.10/ Piece
Local Area: Dongguan, Guangdong, China
R&D Capacity: OEM, ODM, Other
Payment Terms: LC, T/T, D/P, Paypal, Western Union
Brand: HS
Model Number: HS custom PCB manufacturer in shenzhen
Number of Layers: 4-Layer
Base Material: FR4 Aluminum CEM-1 FPC
2layer 4 layer 6layer PCB custom PCB manufacturer in shenzhenWecandoforyou:♦1—12layerFR4PCB,1layerAluminumPCB,1-4layerFlexiblePCB.♦1—3ozcopperthickness.♦0.2mmholesize.♦0.1mmtrackwidth/space.♦SMTPCbaservice.FAQ:Q:1.Canihaveasampletotest?A:Yes,wecansendyousamplestotest.Q:2.WhatspecificationsdoyouneedforPCBquotation?A:WeneedyourPCBGerberfile,boardthickness,copperthickness,surfacefinishingandquantitytoquoteyou.Q:3.Whatistheleadtime?A:Samplesneed3-5days,massproductionneeds7-10days,alsoaccordingtotheordervolume.Q:4.DoyouhaveMOQlimit?A:Even1pcs,wecare.Q:5.Canyouofferthebestpriceforus?A:Yes,wearespecializedPCBmanufacturerdirectly,wecanofferlowerpricethananytradingcompany.Q:6.Howdoyoushipthegoodsandhowlongdoesittakearrival?A:WeusuallyshipbyDHL,UPS,FedExandTNT.Ittakes3-5daystoarrive.Q:7.Whatarethepaymentterms?A:YoucanpayuswithPaypal,WesternUnionandT/TBank.Q:8.Canwevisityourfactory?A:Yes,welcometovisitourfactoryanytime,andwewillleadyoutovisitourfactoryandourproductionline.ManufacturingCapability:
item
ManufactureCapability
Material
FR4,CEM-1,Aluminium,Polyamide
LayerNo.
1-12
Finishedboardthickness
0.1mm-4.0mm
BoardThicknessTolerance
±10%
Cooperthickness
0.5OZ-3OZ(18um-385um)
CopperPlatingHole
18-40um
ImpedanceControl
±10%
Warp&Twist
0.70%
Peelable
0.012"(0.3mm)-0.02’(0.5mm)
Images
MinTraceWidth(a)
0.075mm(3mil)
MinSpaceWidth(b)
0.1mm(4mil)
MinAnnularRing
0.1mm(4mil)
SMDPitch(a)
0.2mm(8mil)
BGAPitch(b)
0.2mm(8mil)
SolderMask
MinSolderMaskDam(a)
0.0635mm(2.5mil)
SoldermaskClearance(b)
0.1mm(4mil)
MinSMTPadspacing(c)
0.1mm(4mil)
SolderMaskThickness
0.0007"(0.018mm)
Holes
MinHolesize(CNC)
0.2mm(8mil)
MinPunchHoleSize
0.9mm(35mil)
HoleSizeTol(+/-)
PTH:±0.075mm;NPTH:±0.05mm
HolePositionTol
±0.075mm
Plating
HASL
2.5um
LeadfreeHASL
2.5um
ImmersionGold
Nickel3-7umAu:1-5u''
OSP
0.2-0.5um
Outline
PanelOutlineTol(+/-)
CNC:±0.125mm,Punching:±0.15mm
Beveling
30°45°
GoldFingerangle
15°30°45°60°
Certificate
ROHS,ISO9001:2008,SGS,ULcertificate

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