New and Hot quantum boards mixed with Samsung LM301B and Cree XPE 660nm 730nm

New and Hot quantum boards mixed with Samsung LM301B and Cree XPE 660nm 730nm
FAQ:
Q:1.Canihaveasampletotest?
A:Yes,wecansendyousamplestotest.
Q:2.WhatspecificationsdoyouneedforPCBquotation?
A:WeneedyourPCBGerberfile,boardthickness,copperthickness,surfacefinishingandquantitytoquoteyou.
Q:3.Whatistheleadtime?
A:Samplesneed3-5days,massproductionneeds7-10days,alsoaccordingtotheordervolume.
Q:4.DoyouhaveMOQlimit?
A:Even1pcs,wecare.
Q:5.Canyouofferthebestpriceforus?
A:Yes,wearespecializedPCBmanufacturerdirectly,wecanofferlowerpricethananytradingcompany.
Q:6.Howdoyoushipthegoodsandhowlongdoesittakearrival?
A:WeusuallyshipbyDHL,UPS,FedExandTNT.Ittakes3-5daystoarrive.
Q:7.Whatarethepaymentterms?
A:YoucanpayuswithPaypal,WesternUnionandT/TBank.
Q:8.Canwevisityourfactory?
A:Yes,welcometovisitourfactoryanytime,andwewillleadyoutovisitourfactoryandourproductionline.
ManufacturingCapability:
item
ManufactureCapability
Material
FR4,CEM-1,Aluminium,Polyamide
LayerNo.
1-12
Finishedboardthickness
0.1mm-4.0mm
BoardThicknessTolerance
±10%
Cooperthickness
0.5OZ-3OZ(18um-385um)
CopperPlatingHole
18-40um
ImpedanceControl
±10%
Warp&Twist
0.70%
Peelable
0.012"(0.3mm)-0.02’(0.5mm)
Images
MinTraceWidth(a)
0.075mm(3mil)
MinSpaceWidth(b)
0.1mm(4mil)
MinAnnularRing
0.1mm(4mil)
SMDPitch(a)
0.2mm(8mil)
BGAPitch(b)
0.2mm(8mil)
SolderMask
MinSolderMaskDam(a)
0.0635mm(2.5mil)
SoldermaskClearance(b)
0.1mm(4mil)
MinSMTPadspacing(c)
0.1mm(4mil)
SolderMaskThickness
0.0007"(0.018mm)
Holes
MinHolesize(CNC)
0.2mm(8mil)
MinPunchHoleSize
0.9mm(35mil)
HoleSizeTol(+/-)
PTH:±0.075mm;NPTH:±0.05mm
HolePositionTol
±0.075mm
Plating
HASL
2.5um
LeadfreeHASL
2.5um
ImmersionGold
Nickel3-7umAu:1-5u''
OSP
0.2-0.5um
Outline
PanelOutlineTol(+/-)
CNC:±0.125mm,Punching:±0.15mm
Beveling
30°45°
GoldFingerangle
15°30°45°60°
Certificate
ROHS,ISO9001:2008,SGS,ULcertificate