Copper molybdenum,copper tungsten heatsinks supplier in china

Changsha Mingguan metal Tungsten-copper Heat Sinkswith smallspace,bigcapacity,theyarecompositesoftungstenandcopper,coppertungstencompositestobeusedextensivelyinthermalmountingplates,chipcarriers,flanges,andframesforhigh-poweredelectronicdevices.Withthethermaladvantagesofcopperwiththeverylowexpansioncharacteristicsoftungsten,coppertungstenhaspropertiessimilartothoseofsiliconecarbide,aluminumoxide,andberylliumoxide.Thethermalconductivityandlowexpansionalsomakecoppertungstenanexcellentchoiceevenforextremelydensecircuits.
Widelyusedinapplicationssuchasoptoelectronicspackages,MicrowavePackages,CPackages,LaserSubmounts,etc
CopperTungstenisoneofthemostpopularrefractorymetalbasedheatsinkmaterialsofferedtoday.Withthenewoff-the-shelfsystem,weareabletoofferstandardproductswithashortlead-timeatextremelycompetitiverates.
AdvantagesHighthermalconductivityExcellenthermeticityExcellentflatness,surfacefinish,andsizecontrolSemi-finishedorfinished(Ni/Auplated)productsavailable
Material
W90Cu10
W88Cu12
W85Cu15
W80Cu20
W75Cu25
TungstenContent(wt%)
90±1
88±1
85±1
80±1
75±1
Densityat20°C(g/cm3)
17.0
16.8
16.3
15.6
14.9
Coefficientofthermalexpansionat20°C(10-6/K)
6.5
6.7
7.0
8.3
9.0
Materials
(articlename)
Composition
[wt%]
Densityat20°C
[g/cm2]
Coefficientof
thermalexpansionat20°C
[10-6/K]
Thermalconductivity
at20°C
[W/(m·K)]
Molybdenum
Mo99.97%
10.2
22°C5.5/800°C5.7
xyz142
Tungsten
W99.95%
19.3
22°C4.5/800°C4.8
xyz165
MoCu
Mo-30%Cu
9.7
22°C7.1/800°C7.8
xyz205
WCu
W-10%Cu
17.1
22°C6.4
xyz195
WCu
W-15%Cu
16.4
22°C7.3
xyz215
WCu
W-20%Cu
15.5
22°C8.3
xyz235
Cu/Mo-30Cu/Cu
(PMC)
1:4:1/
Mo-52%Cu
9.4
200°C9.0/800°C7.3
xy280/z170
Cu/Mo/Cu
(CMC)
1:1:1/
Mo-66%Cu
9.3
22°C8.3/800°C6.4
xy305/z250
Cu/Mo/Cu/.../Cu
(S-CMC)
5:1:5:1:5/
Mo-87%Cu
9.2
200°C12.8/800°C6.1
xy350/z295
Thethermalconductivityandthermalexpansioncharacteristicsofthesemiconductorandthebaseplatemustbeoptimallyharmonizedtoavoidundesireddistortionstothesemiconductor.Thebetterharmonizedthepropertiesare,thebetterthesemiconductormoduleistowithstandsolderingprocessesinvolvedduringmanufactureandthetemperaturecyclesthatoccurduringoperation.Thesketchshowstheprinciplestructureofahermeticallysealedelectronicpackage.
Thermalconductivityandcoefficientofthermalexpansionofdifferentmaterialsindirectcomparison:
Seewhereelseourmaterialsareused
Youcanfindourbaseplatesandheatspreadersincomponentsforoptoelectronics,inhighfrequencyapplicationsaswellasinhighpowerelectronicsandmicroelectronics.
Letusshowyouthemostimportantapplicationfields:·Radiobasestations·HEMT(HEMT=highelectronmobilitytransistors)includingGaNtransistors·MicrowavepackagesforHPA(HighPowerAmplifiers)andMMIC(monolithicmicrowafeintegratedcircuits)inradarapplications·Chip-on-boardtechnologies(COB)·LDMOStransistors(LDMOS=laterallydiffusedmetaloxidesemiconductor)·Laserdiodes·Crystalcarriersforsolidstatelasers·High-powerLEDs,single-emitterLEDs,multi-emitterLEDs·IGBTmodulesforelectricautomotivedrivesystems(EV/HEV)
Perfectmatch
Ourthermalmanagementproductshaveacoefficientofthermalexpansion(CTE)similartothatofthesemiconductormaterials.Ifthesemiconductorandthecarriermaterialhavedifferentthermalexpansionbehaviorsthenmechanicalstressesoccurduringtheproductionofthesemiconductormodulesorduringoperation.Thiscandamagethesemiconductorandcausedevicefailure.
Relax for Safe and strong Package & Delivery
Packing : 3 days for stock goods,5-10 days for custom make,10-30 days for mass production
By air ,standard export wooden case
By sea, standard export wooden case/iron barrel
By express,standard express carton/wooden case
Letusknowyourapplication.WhetherCu/Mo/Cu(CMC),Cu/MoCu/Cu(PMC),MoCu,WCuorpuremoly-ourthermalmanagementteamwewillfindtheperfectmaterialforyou.