VHANDY High Thermal Conductivity Alumina Ceramic for Heatsink Alumina Circle Ceramic Substrate with High Heat ResistanceProduct Description
VHANDY is professional with high quality 96% alumina ceramic substrate products;
Density of product is not less than 3.7g / cm3;
Forming process is mainly gel, casting molding;
Product thickness uniform thickness of up to 0.1mm, tolerance can be controlled within ± 0.01mm;
Surface roughness can reach Ra0.2um, for deep processing, the surface roughness can be controlled below Ra0.02um;
After molding according to the needs of laser processing holes, slots and so on.
Specializing in the production of alumina ceramic substrate, VHANDYhas 23 years of research and development production experience, the production of the product has the following characteristics:
® Strong mechanical stress, shape stability; high strength, high thermal conductivity, high insulation; strong binding, anti-corrosion.
® Excellent thermal cycling performance with up to 50,000 cycles and high reliability.
® Same as PCB (or IMS substrate) etched out of a variety of graphic structure; Pollution-free, pollution-free.
® Wide temperature range -55 ℃ ~ 1480 ℃; Coefficient of thermal expansion close to silicon, simplifying the power module manufacturing process.
Ceramic substrate refers to a special process board in which copper foil is directly bonded to the surface of alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate (single or double) at high temperature. The made of ultra-thin composite substrate with excellent electrical insulation properties, high thermal conductivity, excellent solderability and high adhesion strength, and the same as the PCB can be etched a variety of graphics, with a large current carrying ability. Therefore, the ceramic substrate has become the basis of high-power power electronic circuit structure technology and interconnect technology.
Application:
® High Power Power Semiconductor Modules; Semiconductor Coolers, Electronic Heaters; Power Control Circuits, Power Hybrid Circuits.
® Smart Power Components; High Frequency Switching Power Supply, Solid State Relays.
® Automotive, Aerospace and Military Electronics Components.
® Solar panel components; telecommunications switches, receiving systems; lasers and other industrial electronics.
Superiority:
® Ceramic substrate thermal expansion coefficient close to the silicon chip can save the transition layer Mo film, saving labor, materials, reduce costs;
® Reduce solder layer, lower thermal resistance, reduce voids, improve yield;
® The 0.3mm-thick copper foil at the same current carrying capacity is only 10% of the normal printed circuit board;
® Excellent thermal conductivity, the chip package is very compact, so that the power density greatly improved and improve system and device reliability;
® Ultra-thin (0.25mm) ceramic substrate can replace BeO, no environmental toxicity issues;
® Current carrying capacity, 100A continuous current through the 1mm wide and 0.3mm thick copper body, the temperature rise of about 17 ℃; 100A current through a continuous 2mm wide and 0.3mm thick copper
Body, temperature rise is only about 5 ℃;
® Low Thermal Resistance, Thermal Resistance of 10 x 10mm Ceramic Substrate 0.63mm Thickness Thermal Resistance of Ceramic Substrate 0.31K / W, 0.38mm Thickness Heat of Ceramic Substrate
® Resistance is 0.19K / W, 0.25mm thickness of the thermal resistance of the ceramic substrate is 0.14K / W.
High dielectric strength, personal safety and equipment protection.
® Allows for new packaging and assembly methods that make the product highly integrated and compact.
Performance requirements:
® Mechanical properties
With sufficiently high mechanical strength, it can also be used as a supporting member in addition to the component mounting; good workability, high dimensional accuracy; easy to realize multilayered;
Smooth surface, no warping, bending, micro-cracks and so on.
® Electrical properties
♣ Insulation resistance and insulation breakdown voltage is high;
♣ Low dielectric constant;
♣ Low dielectric loss;
Stable performance under high temperature and high humidity to ensure reliability.
® Thermal properties
♣ High thermal conductivity;
♣ Coefficient of Thermal Expansion Matched with Related Materials (Especially Coefficient of Thermal Expansion with Si);
♣ Excellent heat resistance.
® Other properties
♣ Good chemical stability; easy metallization, circuit graphics and its strong adhesion;
♣ No hygroscopicity; oil, chemical resistance; a ray emission is small;
♣ Substances used pollution-free, non-toxic; in the temperature range of the crystal structure does not change;
♣ Rich raw materials; technology is mature; easy to manufacture; low prices.
Trend:
With the advent of ceramic substrate products, the development of heat dissipation application industry has started. Due to the heat dissipation characteristics of ceramic substrates and the advantages of high thermal dissipation, low thermal resistance, long service life and voltage resistance, ceramic substrates have been speeding up rationalization with the improvement of production technology and equipment , And then expand the LED industry applications, such as the indicator of home appliances, car lights, street lamps and outdoor large billboards. The success of the development of ceramic substrates, but also will become indoor lighting and outdoor lighting products to provide services to the LED industry in the future more broad market areas.
Properties: Performance projectUnitValuePerformance projectUnitValueAlumina contentwt /%≥96Volume resistivityΩ.cm 20℃1012Bulk densityg/cm3≥3.7Breakdown strengthKV / mm≥15Hardness (HRA)HRA≥ 82Acid resistancemg / m2≤7Flexural strengthMPa≥ 320Alkali resistancemg / m2≤0.2Safety temperature℃-55~1480Wear resistanceg / m2≤0.2Water absorption%<0.01Compressive strengthMPa≥ 2400Coefficient of linear expansionx10-6 / ℃7.5 ~ 8.5Bending strengthMPa≥200Dielectric constantξ, 20 ° C, -1 MHz9Modulus of elasticityGPa300Dielectric losstanδx10-4, 1MHz3Thermal conductivityW / m.k (20 ℃)24 ~ 25Company Information
Shenyang Vhandy Technology Co., Ltd. has been committed to the design, development and manufacture of industrial ceramics, specialized in manufacturing and exporting ceramic products, such as zirconia ceramic, alumina ceramic, cordierite, mullite, ZTA, silicon carbide, silicon nitride, boron carbide, boron nitride, etc.
After years of efforts and explorations, rich experience has been accumulated, especially in domestic and oversea ceramic processing. Producing capabilities include the latest pressing and compaction technologies, state of the art CNC green machining, sintering and precision diamond grinding techniques. With senior scientists and skilled technicians, we can handle customer drawings under the R&D, producing and processing all types of ceramic pieces. Our products have already passed the ISO 9001 quality certification system and SGS ROSH system. Because of stable performance and high precision, our products have been successfully used in various areas, including electronic, mechanical, aerospace, textile, chemical fileds, as well as scientific researches.
Quality, service and reputation are three main purposes of our company. We will manage our production and check standards strictly according to client’s drawings. We promise we will spare no efforts to serving our clients with high-quality products. Welcome clients around the world come to contact us.Our CertificationsPackaging & ShippingFAQ
Q: Are you trading company or manufacturer?
A: We are manufacturer.Q: How long is your delivery time?
A: Generally within 30working days, it is according to quantity.Q: Do you provide samples? Is it free or extra?
A: The samples can be provided, but the shipping cost should be on buyer's account.Q: What is your term of payment?
A: Payment<=10000 USD, 100% in advance. Payment>=10000 USD, 70% T/T in advance, balance before shipment.Contact Us
