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E536B H536 UL-94v0 epoxy AB glue thermal conductive adhesive for electronic potting

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Min. Order / Reference FOB Price
1 Kilogram	US $15.00/ Kilogram

Local Area:	Taiwan, China
R&D Capacity:	OEM, ODM, Other
Payment Terms:	LC, T/T, D/P, Paypal, Western Union

Brand:	FONG YONG
Other Names:	potting compounds
Place of Origin:	Taiwan, China
Classification:	Double Components Adhesives

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E536B/H536 UL-94v0 epoxy AB glue thermal conductive adhesive for electronic pottingE536B/ H536
E536B/H536 is a fire retardant, medium temperature cure epoxy potting/encapsulating compounds/glue/resins/adhesive. It is designed for application where UL-94v0 approved, thermal conductive, excellent electrical properties, high operating characteristic and large size casting or potting are required.
Features:1. Flame retardant approval UL94-V0.2. Good electrical properties.3. Long pot life.4. Low shrinkage. Strong bonding strength to most substrates.5. Excellent thermal conductivity.6. Very good chemical resistance and water proof.7. High heat distortion temperature (HDT). High RTI.
Pre-cure properties:
E536
H536
Appearance
Black liquid
Light amber liquid
Specific Gravity
(25°C)
1.60 – 2.00
1.10 – 1.25
Viscosity(cps,25°C)
150,000-240,000
50 - 160
Curing conditions:
Mixing ratio (by weight)
100 : 30
Mixture viscosity: (@40°C,cps)
(@60°C,cps)250 ~ 450
Pot life ( 25°C)
24 hrs
Curing conditions
80°Cx 2 hours + 120°Cx4 hours