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Epoxy Optical LED potting casting encapsulating resin adhesive compound

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Min. Order / Reference FOB Price
1 Kilogram	US $15.00/ Kilogram

Local Area:	Taiwan, China
R&D Capacity:	OEM, ODM, Other
Payment Terms:	LC, T/T, D/P, Paypal, Western Union

Brand:	FONG YONG
Place of Origin:	Taiwan, China
Classification:	Double Components Adhesives
Main Raw Material:	Epoxy

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Epoxy Optical LED potting casting encapsulating resin adhesive compound
Description:
E-117S/H-117S is a two-component, hard type modified polyurethane-epoxy resin. It is specially designed for optical potting/encapsulating, and 3D doming. This formulation is widely applied on LED encapsulating, fiber optical applications, and any potting application requiring optimum clarity, and 3D doming of labels, badges, and nameplates, etc..
Features:
1.Non-porous, water and chemical resistant.
2.Water clear.
3.Easy and simple to mix.
4.Low cost.
5.Better UV resistance than epoxy.
Typical Properties:
E-117S H-117S
Appearance Water Clear liquid Water Clear liquid
Specific Gravity (25) 1.160.97
Viscosity (100g, 25) 2,000-6,000 10-50
Mixing Information:
Ratio by weight 4 :1
Curing:
Pot life (25, 100g) 40-50 minutes
Recommended Curing1) R.T.: 16-24 hours (following to the thickness and
schedule size to be applied, or
2) 60 degree C x 120 minutes
Typical Physical Properties as Cured:
Hardness70~80 Shore D
Compressive Strength (psi) 650-700
Bond Strength (psi) 3,300
Tensile Strength (psi)2,550
Flexural Strength (psi) 5,400
Shrinkage (%)0.003~0.005
Dielectric Strength (v/mil)300-350
Volume Resistivity (ohm-cm)1.5x1010
Arc Resistance (sec) 800-100