Epoxy adhesive encapsulant for COB

Epoxy adhesive encapsulant for COB
EP-12F-BK is a one-component heat curable epoxy designed for encapsulation of IC in chip-on-board (COB) application. It has long pot life, is easy to use and has good physical properties after fully cured. It exhibits good adhesion on all types of PCB with high Tg, good thermal shock properties and water resistance. It can also be used in bonding of electornic parts, ceramics and metals.
EP-12F-BK does not contain hazardous substances in the Candidate Lists of Restriction of Hazardous Substances (RoHs) or Substances of Very High Concern (SVHC) of REACH for green environmental protection. It exhibits the following features
1. One-component, easy for operation.
2. Good thermal properties.
3. Excellent adhesive properties to most metals and plastics.
4. Good electrical properties.
5. Good chemical resistance.
6. Environment friendly.
ApplicationsDam epoxy in dam-and-fill encapsulation of ICsChip-on-board encapsulationSealing of electronic and electrical devices
Properties of Uncured Material
AppearanceColorSpecific Density (25°C)Properties of Cured Material
Hardness, Shore DShrinkage (%)Tensile strength (psi)Dielectric constantDielectric strength (v/mil)Volume resistivity (ohm-cm)Thermal conductivity (cal/sec/cm2°C/cm x10-4HDT Coefficient of linear thermal expansion (cm/cm oC, 5 oC - 150 oC) Lap shear strength
(Kgf/cm2,iron to iron)Cure Schedule
Heat at 80°C for 1 hour,then raise up to 120°Cfor 2 more hours.
*The curing conditions will depend on heating temperature, thickness and size.
Storage and Shelf Life1. Cold storage at 5 oC or lower and dry place. Shelf life is about 6 months in original unopened container.2. Avoid from light, high temperature and high humidity environment.3. Use up as soon as possible when opened. If customer does not use all up in once, please seal tightly to preserve left over at cold storage.
Packaging 1 Kg