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High temperature resistance one part epoxy glue adhesive resin for electronic devices

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Min. Order / Reference FOB Price
1 Kilogram	US $15.00/ Kilogram

Local Area:	Taiwan, China
R&D Capacity:	OEM, ODM, Other
Payment Terms:	LC, T/T, D/P, Paypal, Western Union

Brand:	FONG YONG
Other Names:	Epoxy resin
Place of Origin:	Taiwan, China
Classification:	Other Adhesives

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High temperature resistance one part epoxy glue adhesive resin for electronic devices
EP-A is one part, no volatile content epoxy resin. It exhibits several outstanding properties as follows:
1. Single component, easy to use.
2. Could be cured at low temperature compare with ordinary one component epoxy adhesive.
3. Excellent heat distortion temperature.
4. Compatible with most metal, plastic material adhesion.
5. Good electrical and chemical properties.
6. Cold storage temperature: 2-10 degree C.
Properties:
Appearance: Black paste
Viscosity (25 degree C,cps): 40000-50000
Hardness (25 degree C): Shore D 90
Cure condition: 80 degree C x 30 minutes or 120 degree C x 20 minutes
Linear strength (in/in): 0.015
Tensile strength (psi): 2,650
Compressive strength (psi): 12,780
Thermal Conductivity (cal/sec/cm2/degree C/cm x 10-4: 6.8
Heat distortion temperature: 130 degree C
Volume resistivity (ohm-cm): 8 x 10(15)
Dielectric strength (v/mil): 450
Dielectric constant: 4.0