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Potting AB adhesive epoxy resin glue for potting electronic components E532 H532

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Min. Order / Reference FOB Price
1 Kilogram	US $15.00/ Kilogram

Local Area:	Taiwan, China
R&D Capacity:	OEM, ODM, Other
Payment Terms:	LC, T/T, D/P, Paypal, Western Union

Brand:	FONG YONG
Other Names:	potting compounds
Place of Origin:	Taiwan, China
Classification:	Double Components Adhesives

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Potting AB adhesive epoxy resin glue for potting electronic components E532/H532
E532 B/H532 is a flame resistant RT and heat cure epoxy resin. It is designed for massive pottings, particularly for the requirements of UL94 fire resistance and good dielectric properties. It does not contain hazardous substances in the candidate lists of Restriction of Hazardous Substances (RoHs) and Substances of Very High Concern (SVHC) for green environmental protection.
Features:
1. Excellent flame resistant, UL94V0 approval (E120665).
2. Excellent dielectric properties.
3. Long pot life.
4. Low shrinkage, excellent adhesion properties to most materials.
5. Good thermal conductivity.
6. Excellent chemical resistance and waterproof.
7. Green environmental protection.
Characteristics as supplied:
E532B
H532
Appearance
Black Liquid
Clear Liquid
Viscosity(25°C,cps
3,000~7,000
10~100
Specific Density (25°C)
1.50 ~ 1.60
0.94~1.02
Mix Ratio(wt/wt)
100
15
Characteristics of curing process:
Mix Viscosity, (25°C,cps)
1,000 ~ 4,000
Pot Life ( 60g,25°C)
60 mins
Cure Condition
RT:10~24 hoursShelf Life (below 25°C)
(Dry cool closed container)
12 months
*Pot life and cure time depend on the quantity and thickness.