Potting adhesive of epoxy resin for flame resistance potting of electronic components

Potting adhesive of epoxy resin for flame resistance potting of electronic components
E-759-1/H-759-1 is a two component, modified, medium viscosity epoxy resin. It is used as potting, casting and encapsulating. The elastic and low shrinkage characters are best suited for sensitive electrical and electronic components. It has the following outstanding features:
1. The cured resin is elastic, offering excellent thermal and mechanical shock resistance.
2. The internal stress occurred during curing process is very slight, harmless to delicate electrical and electronic components potting.
3. Flame retardand recognized under UL-94v0
4. Comply with RoHS spec standards.
5. Simple mixing and easy handling.
6. Can be cured either at room temperature or elevated temperature.
7. Good adhesive strength and thermal conductivity.
8. Excellent chemical resistance and water proof.Description Unit E-759-1 H-759-1
Appearance--Black liquidIvory white liquid
Viscosity(25°C) cps 25,000~30,000 600~800Mixing Ratio100:40
Pot Life (100g,25°C) approx. 1 hours ( following the thickness and the size to be coated/domed).
Curing Time R.T.: 10~12 hours
Setting TimeR.T: 7 days or 60°C x 2hrs + 80°C x 2hrsDielectric Constant 4.1
Dielectric Strength V/mil 380
Volume Resistivity ohm-cm 6.5 x 1015
Shrinkage % 0.20
Thermal Conductivitycal/sec/cm2/°C/10-4 8.5