Business Type:
Manufacturer/Factory,Agent,Distributor/Wholesaler
Business Range:
adhesive, silicone, AB glue, epoxy resin, Polyurethane PU resin
Establishment:
1983
R&D Capacity:
OEM, ODM, Others
Terms of Payment:
LC, T/T, D/P, Paypal, Western Union
Main Markets:
Southern Europe, Northern Europe, Central America
OEM/ODM Service
Sample Available

Founded in 1983 in Taiwan, FONG YONG CHEMICAL CO., LTD. is one of the leading manufacturers of high performance adhesive, sealant, coatings, potting and encapsulation compounds and 3D doming resins in...

1
    YRS
General Supplier

Silicone gel Silicone sealants for electronics

Get Latest Price
Min. Order / Reference FOB Price
1 Kilogram US $15.00/ Kilogram
Local Area: Taiwan, China
R&D Capacity: OEM, ODM, Other
Payment Terms: LC, T/T, D/P, Paypal, Western Union
Brand: FONG YONG
Other Names: silicone gel
MF: silicone
Place of Origin: Taiwan, China

Silicone gel Silicone sealants for electronics
Silicone gels formulated to form a very soft cured elastomer. The material can provide the very best environmental protection and is able to absorb potentially damaging vibration. These soft energy absorbent gels find two major application areas, medical and electronics. An additional physical property of many silicone gels is their optical clarity, opening new applications in the development of LED lighting technologies.
SC-723 is a transparent odorless two-part heat-cure silicone gel, specially designed to seal, protect and preserve the electrical characteristics of delicate electronic circuits in severe environments. It forms a self-healing, cushioning, resilient gel-like mass when mixed in a 10 to 1 ratio by weight or by volume. The heat cured gel develops much of the non-flow characteristics and dimensional stability of a solid elastomer and retains much of the stress relief and self-healing properties of a liquid as well. It has excellence in electrical properties, waterproof, fire resistance, and weather resistance. Those properties are not significantly affected by the changes of temperature. Its primary uses include seal of electronic devices, falsies, and cushioning potting.
FeaturesNo solvent, no odor.No toxicity and no cure by-product.Low viscosity and easy processing.No significant exotherm or shrinkage during curing.Resilient gel-like with pressure adhesion property.Good physical and electrical stability over a wide temperature range from -50 to 200 oC.Protection from mechanical shock and vibration.Good waterproof properties, protection from moisture, dirt, and atmospheric contaminants.Good electrical properties.Good weather resistance.
Characteristics precure
Appearance Sp. gravity (25oC) Viscosity (25oC, cps) Non-volatile content (%)
(2g/2hrs/150 oC) Mix ratio Pot life (25oC, 100g) Reaction conditionCharacteristics after cure
Appearance Hardness (Shore 00) Non-volatile content (%)
After cured
(2g/2hrs/150 oC) Volume Resistance (ohm-cm) Dielectric strength (KV/mm) Dielectric constant (100 Hz) Dielectric Dissipation Factor
(100 Hz) Thermal Conductivity
(cal/cm.sec.oC) Coefficient of Thermal
Expansion (cc/cc oC)

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