Silicone heat sink compound for thermal conductivity of electronic devices
Most electronic components produce heat when in use. Theunwanted heat must be dissipated away from the components tomaintain performance and avoid premature failure of the components or device. The need for efficient transfer of heat hasbecome a key design requirement as components continue toreduce in size and increase in power, this is particularly apparent with microchip processors, LED’s and power packs.
SB-442 is RTV 1-part neutral silicone sealants. It exhibits high thermal conductivity due to heavily filled with heat-conductive metal oxides. They exhibit good adhesion properties to most materials, such as transportation tools, boat, airplane, metals, glass, ceramics and electronic devices. At room temperature curing process, they do not generate heat neither corrosive by-product. They are very stable to wide changes of temperature. They help to maintain a positive heat sink seal that improves heat transfer from the electrical / electronic devices to the heat sink or chassis, thereby increasing overall efficiency of the devices. The obvious benefits of using a thermally conductive adhesive enable you to permanently bond your component to some form of heat sink and eliminate the need for additional mechanical fixings. It will also prevent the possibility of movement and air gaps forming which will reduce performance.
FeaturesNeutral, no corrosive by-product.Easy operation (premixing and heating are not required).Excellent adhesion properties for a variety of materials.Good thermal conductivity.Good waterproof and chemical resistance.Excellent dielectric properties and weather resistance.Wide service temperature range (-40oC ~ 200oC).
Characteristics
Appearance Tack Free Time Room Temperature Cure Time Specific Gravity (25 oC) Shrinkage (%) Hardness (Shore A) Water absorption (%, 24 hrs) Tensile Strength (psi) Elongation (%) Tear Strength (ppi) Thermal Conductivity (W/mK)