Supplier Homepage Metallurgy, Chemicals, Rubber & Plastics Chemicals Adhesives & Sealants casting encapsulation

casting encapsulation

Min. Order / Reference FOB Price
1 Kilogram	US $15.00/ Kilogram

Local Area:	Taiwan, China
R&D Capacity:	OEM, ODM, Other
Payment Terms:	LC, T/T, D/P, Paypal, Western Union

Brand:	FONG YONG
Other Names:	potting material
Place of Origin:	Taiwan, China
Classification:	Double Components Adhesives

Contact Now Request Sample Customized Request

Favorites

Product Description

Customer Question & Answer

Ask something for more details

(0)

epoxy potting compounds resins epoxy adhesive for electronic potting, casting, encapsulation
E-190B/H-190 is a two components, electronic grade, rigid type liquid epoxy resin. The cured compound exhibits several outstanding physical and electrical properties. It is specially designed for potting/casting/encapsulating of electrical and electronic assembly. Some special features of this product is as follows:
1. Low viscosity, no volatile content.
2. High gloss at cured compound.
3. High degree of strength can be obtained by room temperature cure.
4. High tensile, compression and flexural strength.
5. Excellent dielectric constant, dielectric strength and thermal cycling resistance.
6. Good chemical resistance. Description Unit E-190 H-190
Appearance--Clear Liquid Clear Liquid
Viscosity(25°C) cps4,000~5,00090~110 Mixing Ratio100 40
Pot Life (100g, 25°C) approx. 4-5 hours ( following the thickness and the size to be coated/domed).
Cure Condition R.T.: 24 hours, or 80°C : 120 mins Compression Strength kg/cm2 650
Flexural Strengthkg/cm2 900
Tensile Strength kg/cm2 600
Dielectric Strengthv/mil502
Dielectric Constant4.15
Volume Resistivity ohm-cm 1.6 x 1016