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two components epoxy potting casting adhesive glue resin compounds

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Min. Order / Reference FOB Price
1 Kilogram	US $15.00/ Kilogram

Local Area:	Taiwan, China
R&D Capacity:	OEM, ODM, Other
Payment Terms:	LC, T/T, D/P, Paypal, Western Union

Brand:	FONG YONG
Other Names:	potting epoxy
Place of Origin:	Taiwan, China
Classification:	Double Components Adhesives

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two components epoxy potting casting adhesive glue resin compounds
E-733B/H-733 is a soft type epoxy resin, particularly designed for electronic uses. Other than those properties of epoxy resin, it exhibits the following features:Excellent elasticity and adhesion to very fine printing circuits, delicate electronic devices, wire attachment. Excellent mechanical properties, such as tensile strength, compression resistance, flexural resistance, and impact resistance.Excellent dielectric properties, widely used on sealing, insulation, and potting.Containing no solvent, low viscosity, easy to use.Cured product exhibits high glossy surface, quality will be enhanced.Can be cured at room temperature or elevated temperature.
CharacteristicsAppearance Viscosity (25oC, cps)
1,300 – 1,800Mixing ratio (wt/wt)Gel time (25°C)Pot life (25oC, 100g)Cure condition
Room temperature 7days
Heating 50°C x 1 hr + 100°Cx 3hrs
Shrinkage (in/in)Flexural strength (psi)Tensile strength (psi)Dielectric constantDielectric strength (V/mil)Volume resistivity (ohm-cm)
1.6x1015