Plasma surface treatment machine for battery surface bonding and printing

Plasma surface treatment machine for battery surface bonding and printing
Wire bonding (Wire Bonding) is the use of fine metal wire, using heat, pressure, ultrasonic energy to make metal lead and substrate pad close welding, to achieve the chip and substrate electrical interconnection and information exchange between chips. Under ideal control conditions, electron sharing or atomic diffusion will occur between the lead wire and the substrate, so that the bonding between the two metals can be achieved in the order of atoms.
the role of wire bonding is to introduce and derive electrical connections from core elements. In industry, there are usually three kinds of wire bonding positioning platform technology: hot pressing wire bonding, wedge ultrasonic wire bonding, thermoacoustic wire bonding.
Lead bonding is a common and effective connection process between chip and external package. According to statistics, about 70% of product failures are caused by bonding failure. This is because the impurity contamination of the pad and thick film conductor is a main reason for the decrease of solderability and reliability of wire bonding. Including chip, chopper and gold wire and other links can cause pollution.
If it is not cleaned in time and bonded directly, it will cause defects such as virtual welding, de-welding and low bonding strength. Using Ar and H2 mixed gases for tens of seconds of on-line plasma cleaning, pollutants can react to produce volatile carbon dioxide and water. Because of the short time of plasma cleaning, the passivation layer around the bonding zone will not be damaged while removing pollutants. Therefore, on-line plasma cleaning can effectively remove pollutants from the bonding zone, improve the bonding performance of the bonding zone, enhance the bonding strength, and plasma cleaning can greatly reduce the failure rate of the bonding.
Product Description
ModelTS-PL30MA/60MA/110MA/150MA/180MA/200MACavity material316 stainless steel/imported aluminum alloy(optional)Power frequency40KHz/13.56MHzPowerTS-PL60MA/110MA 0-500W(Adjustable)
TS-PL150MA/180MA/200MA 0-1000W(Adjustable)Treatment layers11/15/17/17/21Vacuum degree0-100pa(adjustable)Gas flow control0-500SCCM(MFC+-2%)Electrode ceramicsimported high frequency ceramicsGas channelTwo-way(addable):Ar,N,H,CF,OxygenSystem control softwareSelf-developed V2.0Control modePLC+touch screenVacuum cavity temperatureless than 30℃Vacuum pumpOil pump/dry pump(optional)+roots combinationCapacity30L/60L/110L/150L/180L/200LCavity dimensions(LxWxH)mm400*450*400mm
500*450*500mm
500*500*600mm
500*600*600mm
600*580*700mmOverall dimensions(LxWxH)mm1000*1030*1630mm
1100*1030*1680mm
1200*1100*1730mm
1200*1200*1730mm
1250*1230*1790mmApplicationGlass,Touch green,Material science,Printing,Paper manufacturing,Ink coating,Medicine & healthcare,Thin film polymer,Electronic
circuit,Textile fibre,Chemistry and chemical industry,petrochemical industry.Featurea.highly stable and applicable to large scale continuous production.
b.special electrode structure to ensure plasma evenness.
c.applicable to the products of all shapes,high generality.
d.self-developed integrated control system software is easy to operate.
e.highly safe,multi-functional safety protection
f.the cavity dimensions and layers can be customized to satisfy customers"diversified demands
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